Invention Grant
- Patent Title: Method for fabricating wire bonding structure
- Patent Title (中): 线接合结构的制造方法
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Application No.: US14085981Application Date: 2013-11-21
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Publication No.: US09289846B2Publication Date: 2016-03-22
- Inventor: Wei-Sheng Lin , Lung-Tang Hung , Meng-Hung Yeh , Zhi-Lun Hsieh , Yude Chu
- Applicant: Siliconware Precision Industries Co., Ltd
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW102126231A 20130723
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K20/00 ; H01L23/00
Abstract:
A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
Public/Granted literature
- US20150028081A1 METHOD FOR FABRICATING WIRE BONDING STRUCTURE Public/Granted day:2015-01-29
Information query
IPC分类:
