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公开(公告)号：US10587037B2
公开(公告)日：2020-03-10
申请号：US14107446
申请日：2013-12-16
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Chien-Cheng Lin , Tsung-Hsien Tsai , Chao-Ya Yang , Yude Chu
Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
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公开(公告)号：US09502758B2
公开(公告)日：2016-11-22
申请号：US14146163
申请日：2014-01-02
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC classification number: H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
Abstract translation: 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US09337250B2
公开(公告)日：2016-05-10
申请号：US14087554
申请日：2013-11-22
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。
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公开(公告)号：US09997477B2
公开(公告)日：2018-06-12
申请号：US15094125
申请日：2016-04-08
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC classification number: H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
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公开(公告)号：US09355989B2
公开(公告)日：2016-05-31
申请号：US14584463
申请日：2014-12-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Wei-Sheng Lin , Lien-Chen Chiang , Lung-Tang Hung , Meng-Hung Yeh , Yude Chu
CPC classification number: H01L24/43 , B23K20/004 , B23K20/007 , B23K20/233 , B23K2101/34 , B23K2101/40 , B23K2101/42 , B23K2103/08 , B23K2103/18 , B23K2103/26 , B23K2103/42 , H01L24/45 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/437 , H01L2224/43985 , H01L2224/45144 , H01L2224/85045 , H01L2224/85444 , H01L2224/85455 , H01L2224/859 , H01L2924/00014 , H01L2924/3701 , H01L2924/386 , H01L2224/45015 , H01L2924/207 , H01L2924/01079 , H01L2224/05599
Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.
Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。
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Patent Agency Ranking
公开(公告)号：US20160081234A1
公开(公告)日：2016-03-17
申请号：US14607743
申请日：2015-01-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Hsin-Lung Chung , Chia-Yang Chen , Chao-Ya Yang , Yude Chu , Chih-Ming Cheng
IPC: H05K9/00
CPC classification number: H01L23/552 , H01L25/0657 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014
Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.
Abstract translation: 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。
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公开(公告)号：US20150145747A1
公开(公告)日：2015-05-28
申请号：US14146163
申请日：2014-01-02
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC classification number: H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
Abstract translation: 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US20140353850A1
公开(公告)日：2014-12-04
申请号：US13971189
申请日：2013-08-20
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen , Chih-Ming Cheng , Yude Chu
CPC classification number: H01L24/85 , H01L23/3121 , H01L23/4334 , H01L23/552 , H01L23/66 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/04042 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8592 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.
Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。
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公开(公告)号：US20140210672A1
公开(公告)日：2014-07-31
申请号：US14107446
申请日：2013-12-16
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Chien-Cheng Lin , Tsung-Hsien Tsai , Chao-Ya Yang , Yude Chu
IPC: H01Q1/38
Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
Abstract translation: 提供一种电子封装结构，包括基板，设置在基板上的封装密封剂，以及对应于封装密封剂的布置区域的天线结构，并具有第一延伸层，设置在基板上的第二延伸层和 连接部分设置在第一延伸层和第二延伸层之间并且电连接到第一延伸层和第二延伸层。 通过在封装密封剂的配置区域上形成天线结构，不需要扩大基板，因此电子封装结构满足小型化要求。
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公开(公告)号：US09502377B2
公开(公告)日：2016-11-22
申请号：US13971189
申请日：2013-08-20
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen , Chih-Ming Cheng , Yude Chu
IPC: H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , H01L23/433 , H01L25/065 , H01L23/31 , H01L23/552 , H01L23/66
CPC classification number: H01L24/85 , H01L23/3121 , H01L23/4334 , H01L23/552 , H01L23/66 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/04042 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8592 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.
Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。
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