发明授权
- 专利标题: Laser machining device
- 专利标题(中): 激光加工装置
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申请号: US14003678申请日: 2012-03-13
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公开(公告)号: US09289850B2公开(公告)日: 2016-03-22
- 发明人: Tatsuya Yamamoto , Junichi Nishimae , Shuichi Fujikawa
- 申请人: Tatsuya Yamamoto , Junichi Nishimae , Shuichi Fujikawa
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2011-086164 20110408; JP2011-204750 20110920
- 国际申请: PCT/JP2012/056393 WO 20120313
- 国际公布: WO2012/137579 WO 20121011
- 主分类号: B23K26/046
- IPC分类号: B23K26/046 ; B23K26/064 ; B23K26/70 ; B23K26/00 ; B23K26/04 ; B23K26/06
摘要:
A laser machining apparatus, including: a laser light source; a transparent member that is set on an optical path of a laser beam and transmits the laser beam; a contact type temperature difference sensor, set on a surface of the transparent member outside an irradiation range of the laser beam, for detecting a temperature difference between a surface of the transparent member, which is spaced apart from a center of the transparent member by a first distance, and another surface of the transparent member, which is spaced apart from the center of the transparent member by a second distance larger than the first distance; and a controller correcting a focal position based on the temperature difference detected by the contact type temperature difference sensor to stabilize a beam diameter of the laser beam condensed onto a machining object.
公开/授权文献
- US20130341309A1 LASER MACHINING DEVICE 公开/授权日:2013-12-26
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