Invention Grant
US09290638B2 Resin additive, polyphenylene sulfide resin composition, and electronic device
有权
树脂添加剂，聚苯硫醚树脂组合物和电子器件
- Patent Title: Resin additive, polyphenylene sulfide resin composition, and electronic device
- Patent Title (中): 树脂添加剂，聚苯硫醚树脂组合物和电子器件
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Application No.: US14208101Application Date: 2014-03-13
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Publication No.: US09290638B2Publication Date: 2016-03-22
- Inventor: Hiroyuki Okuhira , Akira Takakura , Hiroshi Katou
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-053448 20130315
- Main IPC: C08K5/372
- IPC: C08K5/372 ; C08K5/18
Abstract:
A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group, and n is a natural number of 1 to 10. A polyphenylene sulfide resin composition includes the resin additive and a polyphenylene sulfide resin. An electronic device includes a molded product of the polyphenylene sulfide resin composition.
Public/Granted literature
- US20140262414A1 RESIN ADDITIVE, POLYPHENYLENE SULFIDE RESIN COMPOSITION, AND ELECTRONIC DEVICE Public/Granted day:2014-09-18
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