发明授权
- 专利标题： Substrate bonding system and method of modifying the same
- 专利标题（中）： 基材粘合体系及其改性方法
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申请号： US12844113申请日： 2010-07-27
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公开(公告)号： US09299594B2公开(公告)日： 2016-03-29
- 发明人: Yu-Liang Lin , Weng-Jin Wu , Jing-Cheng Lin
- 申请人： Yu-Liang Lin , Weng-Jin Wu , Jing-Cheng Lin
- 申请人地址： TW
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW
- 代理机构： Hauptman Ham, LLP
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/683 ; H01L21/66 ; H01L23/00 ; H01L25/065
摘要：
The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.
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