Invention Grant
- Patent Title: Thermal processing apparatus for thermal processing substrate and positioning method of positioning substrate transfer position
- Patent Title (中): 用于热处理基板的热处理装置和定位基板转印位置的定位方法
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Application No.: US14248765Application Date: 2014-04-09
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Publication No.: US09299599B2Publication Date: 2016-03-29
- Inventor: Yuichi Douki , Tokutarou Hayashi , Naruaki Iida , Suguru Enokida
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2011-045665 20110302
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05B3/68 ; C23C16/00 ; H01L21/68 ; H01L21/67 ; H01L21/677 ; H01L21/687 ; H01L21/66
Abstract:
A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.
Public/Granted literature
Information query
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