Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.