公开(公告)号：US09490787B1

公开(公告)日：2016-11-08

申请号：US14737224

申请日：2015-06-11

Applicant: Infineon Technologies AG

Inventor： Rex Kho ,  Andreas Weisgerber ,  Dirk Hesidenz

IPC: H04L7/00 ,  H03K5/135 ,  H03L7/081 ,  H03L7/091 ,  H03K5/00

CPC classification number: H03K5/135 ,  H03K2005/00019

Abstract: An embodiment integrated circuit (IC) clock distributor system includes a first IC. The first IC includes a clock synchronizer circuit and a clock generator circuit. The clock synchronizer circuit includes a first input coupled to a first clock transfer path including a replica delay of a portion of a first signal path included in an external IC. The clock synchronizer circuit also includes a second input coupled to a second clock transfer path. The clock generator circuit also includes an input coupled to an output of at least one of a reference oscillator and the clock synchronizer circuit. Delay of the second clock transfer path includes delay of the first signal path.

Abstract translation: 实施例集成电路（IC）时钟分配器系统包括第一IC。 第一IC包括时钟同步器电路和时钟发生器电路。 时钟同步器电路包括耦合到包括外部IC中包括的第一信号路径的一部分的复制延迟的第一时钟传送路径的第一输入。 时钟同步器电路还包括耦合到第二时钟传送路径的第二输入。 时钟发生器电路还包括耦合到参考振荡器和时钟同步器电路中的至少一个的输出的输入。 第二时钟传送路径的延迟包括第一信号路径的延迟。

公开(公告)号：US09299673B2

公开(公告)日：2016-03-29

申请号：US14288726

申请日：2014-05-28

Applicant: Infineon Technologies AG

Inventor： Peter Ossimitz ,  Matthias Von Daak ,  Dirk Hesidenz

IPC: H01L21/768 ,  H01L23/485 ,  H01L23/48 ,  H01L23/00 ,  G11C5/06 ,  H01L23/50 ,  H01L21/66 ,  H01L23/528

CPC classification number: H01L24/09 ,  G11C5/06 ,  H01L22/32 ,  H01L23/50 ,  H01L23/5286 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/06137 ,  H01L2224/09179 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.

Abstract translation: 本发明的实施例涉及一种包括多个接触焊盘的半导体芯片，其布置在半导体芯片的表面上的边缘区域中。 在半导体芯片的半导体区域中，多个接触焊盘的每个接触焊盘具有提供的相关联的焊盘单元，其包括驱动器或接收器中的至少一个，并且被配置为驱动输出信号或接收其相关联的输入信号 接触垫，如果驱动器或接收器连接到接触垫。 此外，对于用作供电接触焊盘的接触焊盘，相关联的焊盘单元的驱动器或接收器不连接到接触焊盘或用于驱动输出信号或接收其上的输入信号的接触焊盘或任何其它接触焊盘。

公开(公告)号：US20140264814A1

公开(公告)日：2014-09-18

申请号：US14288726

申请日：2014-05-28

Applicant: Infineon Technologies AG

Inventor： Peter Ossimitz ,  Matthias Van Daak ,  Dirk Hesidenz

IPC: H01L23/00

CPC classification number: H01L24/09 ,  G11C5/06 ,  H01L22/32 ,  H01L23/50 ,  H01L23/5286 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/06137 ,  H01L2224/09179 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.

Abstract translation: 本发明的实施例涉及一种包括多个接触焊盘的半导体芯片，其布置在半导体芯片的表面上的边缘区域中。 在半导体芯片的半导体区域中，多个接触焊盘的每个接触焊盘具有提供的相关联的焊盘单元，其包括驱动器或接收器中的至少一个，并且被配置为驱动输出信号或接收其相关联的输入信号 接触垫，如果驱动器或接收器连接到接触垫。 此外，对于用作供电接触焊盘的接触焊盘，相关联的焊盘单元的驱动器或接收器不连接到接触焊盘或用于驱动输出信号或接收其上的输入信号的接触焊盘或任何其它接触焊盘。