Invention Grant
- Patent Title: Bond-pad integration scheme for improved moisture barrier and electrical contact
- Patent Title (中): 焊垫整合方案,用于改善防潮和电接触
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Application No.: US14533967Application Date: 2014-11-05
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Publication No.: US09304283B2Publication Date: 2016-04-05
- Inventor: Joel Soman , Neng Jiang , Scott Summerfelt , Thomas Warren Lassiter , Nayeemuddin Mohammed , Mary Alyssa Drummond Roby
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: G02B7/09
- IPC: G02B7/09 ; H01L21/3213 ; H04N5/232 ; C23F1/00

Abstract:
An apparatus includes first and second electrodes separated by an insulative material (such as a piezoelectric material). The apparatus also includes a protective layer over the first and second electrodes. The protective layer has a first opening that exposes a portion of the first electrode and a second opening that exposes a portion of the second electrode. The apparatus further includes a first electrical contact at least partially within the first opening and electrically coupled to the first electrode. In addition, the apparatus includes a second electrical contact at least partially within the second opening and electrically coupled to the second electrode. Each of the first and second electrical contacts includes a stack of metal layers. The stack of metal layers includes a titanium nitride layer, a titanium layer over the titanium nitride layer, and an aluminum copper layer over the titanium nitride layer and the titanium layer.
Public/Granted literature
- US20150338604A1 BOND-PAD INTEGRATION SCHEME FOR IMPROVED MOISTURE BARRIER AND ELECTRICAL CONTACT Public/Granted day:2015-11-26
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