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    BOND-PAD INTEGRATION SCHEME FOR IMPROVED MOISTURE BARRIER AND ELECTRICAL CONTACT
    1.
    发明申请
    BOND-PAD INTEGRATION SCHEME FOR IMPROVED MOISTURE BARRIER AND ELECTRICAL CONTACT 有权
    改善水分障碍物和电气接触的粘合剂整体方案

    公开(公告)号：US20150338604A1

    公开(公告)日：2015-11-26

    申请号：US14533967

    申请日：2014-11-05

    Applicant: Texas Instruments Incorporated

    Inventor： Joel Soman ,  Neng Jiang ,  Scott Summerfelt ,  Thomas Warren Lassiter ,  Nayeemuddin Mohammed ,  Mary Alyssa Drummond Roby

    IPC: G02B7/09 ,  C23F1/00 ,  H04N5/232

    CPC classification number: G02F1/29 ,  C23F1/00 ,  C23F4/00 ,  G02B7/09 ,  G02F2001/294 ,  G03B13/36 ,  H01L21/32136 ,  H01L21/32139 ,  H01L41/31 ,  H01L41/332 ,  H04N5/2254 ,  H04N5/232 ,  H04N5/23229

    Abstract: An apparatus includes first and second electrodes separated by an insulative material (such as a piezoelectric material). The apparatus also includes a protective layer over the first and second electrodes. The protective layer has a first opening that exposes a portion of the first electrode and a second opening that exposes a portion of the second electrode. The apparatus further includes a first electrical contact at least partially within the first opening and electrically coupled to the first electrode. In addition, the apparatus includes a second electrical contact at least partially within the second opening and electrically coupled to the second electrode. Each of the first and second electrical contacts includes a stack of metal layers. The stack of metal layers includes a titanium nitride layer, a titanium layer over the titanium nitride layer, and an aluminum copper layer over the titanium nitride layer and the titanium layer.

    Abstract translation: 一种装置包括由绝缘材料（例如压电材料）隔开的第一和第二电极。 该装置还包括在第一和第二电极上的保护层。 保护层具有暴露第一电极的一部分的第一开口和暴露第二电极的一部分的第二开口。 该装置还包括至少部分地在第一开口内并且电耦合到第一电极的第一电接触。 此外，该装置包括至少部分地在第二开口内并电耦合到第二电极的第二电接触。 第一和第二电触点中的每一个包括一叠金属层。 金属层的叠层包括氮化钛层，氮化钛层上的钛层和氮化钛层和钛层上的铝铜层。

    Bond-pad integration scheme for improved moisture barrier and electrical contact
    2.
    发明授权
    Bond-pad integration scheme for improved moisture barrier and electrical contact 有权
    焊垫整合方案，用于改善防潮和电接触

    公开(公告)号：US09304283B2

    公开(公告)日：2016-04-05

    申请号：US14533967

    申请日：2014-11-05

    Applicant: Texas Instruments Incorporated

    Inventor： Joel Soman ,  Neng Jiang ,  Scott Summerfelt ,  Thomas Warren Lassiter ,  Nayeemuddin Mohammed ,  Mary Alyssa Drummond Roby

    IPC: G02B7/09 ,  H01L21/3213 ,  H04N5/232 ,  C23F1/00

    CPC classification number: G02F1/29 ,  C23F1/00 ,  C23F4/00 ,  G02B7/09 ,  G02F2001/294 ,  G03B13/36 ,  H01L21/32136 ,  H01L21/32139 ,  H01L41/31 ,  H01L41/332 ,  H04N5/2254 ,  H04N5/232 ,  H04N5/23229

    Abstract: An apparatus includes first and second electrodes separated by an insulative material (such as a piezoelectric material). The apparatus also includes a protective layer over the first and second electrodes. The protective layer has a first opening that exposes a portion of the first electrode and a second opening that exposes a portion of the second electrode. The apparatus further includes a first electrical contact at least partially within the first opening and electrically coupled to the first electrode. In addition, the apparatus includes a second electrical contact at least partially within the second opening and electrically coupled to the second electrode. Each of the first and second electrical contacts includes a stack of metal layers. The stack of metal layers includes a titanium nitride layer, a titanium layer over the titanium nitride layer, and an aluminum copper layer over the titanium nitride layer and the titanium layer.

    Abstract translation: 一种装置包括由绝缘材料（例如压电材料）隔开的第一和第二电极。 该装置还包括在第一和第二电极上的保护层。 保护层具有暴露第一电极的一部分的第一开口和暴露第二电极的一部分的第二开口。 该装置还包括至少部分地在第一开口内并且电耦合到第一电极的第一电接触。 此外，该装置包括至少部分地在第二开口内并电耦合到第二电极的第二电接触。 第一和第二电触点中的每一个包括一叠金属层。 金属层的叠层包括氮化钛层，氮化钛层上的钛层和氮化钛层和钛层上的铝铜层。

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