An over-current protection device adapted to be soldered onto a circuit board comprises a PTC material layer, a first electrode foil, a second electrode foil, a bonding section and a metal connecting member. The PTC material layer has opposite first and second surfaces. The first electrode foil is in physical contact with the first surface, and the second electrode foil electrically connects to the second surface. Both the second electrode foil and the bonding section are disposed on bottom of the device, and the bonding section is separated from the second electrode foil. The metal connecting member is disposed on the lateral surface of the device. The second electrode foil is adapted to be soldered onto an electrode section of the circuit board. The bonding section and the metal connecting member connect to corresponding joint section of the circuit board.