发明授权
- 专利标题： Processing methods and apparatus with temperature distribution control
- 专利标题（中）： 具有温度分布控制的加工方法和装置
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申请号： US12967381申请日： 2010-12-14
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公开(公告)号： US09324590B2公开(公告)日： 2016-04-26
- 发明人: Alex Gurary , Mikhail Belousov , Vadim Boguslavskiy , Bojan Mitrovic
- 申请人： Alex Gurary , Mikhail Belousov , Vadim Boguslavskiy , Bojan Mitrovic
- 申请人地址： US NY Plainview
- 专利权人： Veeco Instruments Inc.
- 当前专利权人： Veeco Instruments Inc.
- 当前专利权人地址： US NY Plainview
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; C23F1/00 ; H01L21/306 ; H01L21/67 ; C23C16/455 ; C23C16/458 ; C23C16/52 ; H01L21/687
摘要：
Wafer treatment process and apparatus is provided with a wafer carrier arranged to hold wafers and to inject a fill gas into gaps between the wafers and the wafer carrier. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers.
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