Invention Grant
- Patent Title: Adhesive resin composition and molded products
- Patent Title (中): 粘合剂树脂组合物和成型品
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Application No.: US13641182Application Date: 2011-04-08
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Publication No.: US09328271B2Publication Date: 2016-05-03
- Inventor: Yasunori Okada , Takashi Matsumoto , Takao Michinobu
- Applicant: Yasunori Okada , Takashi Matsumoto , Takao Michinobu
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-095183 20100416; JP2010-252152 20101110; JP2011-061498 20110318
- International Application: PCT/JP2011/002095 WO 20110408
- International Announcement: WO2011/129080 WO 20111020
- Main IPC: C08F212/00
- IPC: C08F212/00 ; C09J151/06 ; C08F212/08 ; C08L51/06 ; C08L53/02 ; B32B7/12 ; B32B15/08 ; B32B27/08 ; B32B27/30 ; C08F255/04 ; C08F255/10 ; C08L9/00

Abstract:
An adhesive resin composition, including: a base resin which comprises (A) 30-90 parts by weight of a modified ethylene-olefin copolymer, and (B) 70-10 parts by weight of a styrene thermoplastic elastomer, provided that (A)+(B) equals 100 parts by weight; and (C) a tackifier in an amount of 30-60 parts by weight per 100 parts by weight of the base resin, the modified ethylene-olefin copolymer being one which has been graft-modified with (a) an unsaturated carboxylic acid or a derivative thereof and (b) an aromatic vinyl monomer, comprises 0.1%-5% by weight of (a) the unsaturated carboxylic acid or the derivative thereof, and has a melting point peak in a range of 100-150° C. with an enthalpy of crystal fusion of 0.5-10 J/g as determined by DSC.
Public/Granted literature
- US20130108827A1 ADHESIVE RESIN COMPOSITION AND MOLDED PRODUCTS Public/Granted day:2013-05-02
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