Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14317289Application Date: 2014-06-27
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Publication No.: US09337295B2Publication Date: 2016-05-10
- Inventor: Junehee Lee , Sangjin Hyun , Jaeyeol Song , Hye-Lan Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0086892 20130723
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/49 ; H01L29/66 ; H01L29/51

Abstract:
Semiconductor devices and methods of manufacturing the same are disclosed. The semiconductor device a gate dielectric pattern on a substrate and a gate electrode on the gate dielectric pattern opposite the substrate. The gate electrode includes a first conductive pattern disposed on the gate dielectric pattern and including aluminum, and a second conductive pattern disposed between the first conductive pattern and the gate dielectric pattern. The second conductive pattern has an aluminum concentration that is higher than an aluminum concentration of the first conductive pattern. The second conductive pattern may be thicker than the first conductive pattern.
Public/Granted literature
- US20150028430A1 Semiconductor Devices and Methods of Manufacturing the Same Public/Granted day:2015-01-29
Information query
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