Invention Grant
- Patent Title: Multi-phase source/drain/gate spacer-epi formation
- Patent Title (中): 多相源/漏极/栅极间隔层形成
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Application No.: US14319462Application Date: 2014-06-30
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Publication No.: US09337306B2Publication Date: 2016-05-10
- Inventor: Jianwei Peng , Xusheng Wu , Hong Yu , Zhao Lun
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams Morgan, P.C.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/78 ; H01L27/088

Abstract:
Approaches for forming an epitaxial (epi) source/drain (S/D) and/or a semiconductor device having an epi S/D are provided. In embodiments of the invention, a first portion of the epi S/D is formed in the S/D region on a fin in a finned substrate. After the first portion is formed, but before completion of the formation of the S/D, a secondary spacer is formed in the S/D region. Then, the remainder portion of the S/D is formed in the S/D region. As a result, the S/D is separated from the gate stack by the secondary spacer.
Public/Granted literature
- US20150380515A1 MULTI-PHASE SOURCE/DRAIN/GATE SPACER-EPI FORMATION Public/Granted day:2015-12-31
Information query
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