Invention Grant
- Patent Title: Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias
- Patent Title (中): 毫米波系统包括连接到传输线并被多个通孔包围的波导过渡
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Application No.: US14067640Application Date: 2013-10-30
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Publication No.: US09337522B2Publication Date: 2016-05-10
- Inventor: Saverio Trotta , Jagjit Singh Bal , Maciej Wojnowski , Ernst Seler , Mehran Pour Mousavi
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01P3/12 ; H04B10/2575 ; H04B10/572 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/46
Abstract:
According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
Public/Granted literature
- US20150117862A1 System and Method for a Millimeter Wave Circuit Board Public/Granted day:2015-04-30
Information query
