Invention Grant
- Patent Title: Integrated device die and package with stress reduction features
- Patent Title (中): 集成器件管芯和封装具有减压特性
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Application No.: US14577128Application Date: 2014-12-19
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Publication No.: US09343367B2Publication Date: 2016-05-17
- Inventor: Thomas M. Goida , Xiaojie Xue
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: ANALOG DEVICES, INC.
- Current Assignee: ANALOG DEVICES, INC.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L29/06 ; H01L23/31
Abstract:
An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.
Public/Granted literature
- US20150181697A1 INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES Public/Granted day:2015-06-25
Information query
IPC分类:
