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    Low stress integrated device package
    1.
    发明授权
    Low stress integrated device package 有权

    公开(公告)号：US11702335B2

    公开(公告)日：2023-07-18

    申请号：US17112894

    申请日：2020-12-04

    Applicant: Analog Devices, Inc.

    Inventor： Yeonsung Kim ,  Shafi Saiyed ,  Thomas M. Goida

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81B7/0048 ,  B81C1/0023 ,  B81B2207/015

    Abstract: An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

    Integrated device die and package with stress reduction features
    4.
    发明授权
    Integrated device die and package with stress reduction features 有权
    集成器件管芯和封装具有减压特性

    公开(公告)号：US09343367B2

    公开(公告)日：2016-05-17

    申请号：US14577128

    申请日：2014-12-19

    Applicant: ANALOG DEVICES, INC.

    Inventor： Thomas M. Goida ,  Xiaojie Xue

    IPC: H01L21/78 ,  H01L29/06 ,  H01L23/31

    CPC classification number: H01L25/0657 ,  B81B7/0048 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

    Abstract: An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

    Abstract translation: 公开了一种集成器件管芯和封装。 集成器件裸片包括一体式。 整体可以具有包括一个或多个活性组分的上部部分。 上部可以具有限定上部的周边的至少一部分的第一和第二相对侧边，使得上部的上表面设置在第一和第二相对的侧面的上边缘之间。 整体也可以具有与上部一体地形成的下部。 下部可以包括从上部向下延伸的基座。 基座可以从第一和第二相对侧面的下边缘侧向插入。 基座可以包括配置成联接到托架的远端部分。

    DOUBLE-SIDED PACKAGE
    7.
    发明申请
    DOUBLE-SIDED PACKAGE 有权
    双面包

    公开(公告)号：US20140217566A1

    公开(公告)日：2014-08-07

    申请号：US13757299

    申请日：2013-02-01

    Applicant: ANALOG DEVICES, INC.

    Inventor： Thomas M. Goida ,  Xiaojie Xue

    IPC: H01L23/495 ,  H01L23/00

    CPC classification number: H01L23/49575 ,  G01P1/023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/03 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

    Abstract: Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.

    Abstract translation: 本文公开了集成器件封装的各种实施例。 封装可以包括具有第一侧和与第一侧相对的第二侧的引线框架。 引线框架可以包括围绕模具安装区域的多个引线。 第一封装盖可以安装在引线框架的第一侧上以形成第一腔，并且第一集成器件裸片可以安装在第一腔内的引线框架的第一侧上。 第二集成器件管芯可以安装在引线框架的第二侧上。 多个引线中的至少一个引线可以在第一集成器件管芯和第二集成器件管芯之间提供电连通。

    Double-sided package
    9.
    发明授权
    Double-sided package 有权
    双面包装

    公开(公告)号：US09209121B2

    公开(公告)日：2015-12-08

    申请号：US13757299

    申请日：2013-02-01

    Applicant: Analog Devices, Inc.

    Inventor： Thomas M. Goida ,  Xiaojie Xue

    IPC: H01L23/495 ,  H01L23/04 ,  H01L23/00 ,  G01P1/02

    CPC classification number: H01L23/49575 ,  G01P1/023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/03 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

    Abstract: Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.

    Abstract translation: 本文公开了集成器件封装的各种实施例。 封装可以包括具有第一侧和与第一侧相对的第二侧的引线框架。 引线框架可以包括围绕模具安装区域的多个引线。 第一封装盖可以安装在引线框架的第一侧上以形成第一腔，并且第一集成器件裸片可以安装在第一腔内的引线框架的第一侧上。 第二集成器件管芯可以安装在引线框架的第二侧上。 多个引线中的至少一个引线可以在第一集成器件管芯和第二集成器件管芯之间提供电连通。

    INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES
    10.
    发明申请
    INTEGRATED DEVICE DIE AND PACKAGE WITH STRESS REDUCTION FEATURES 有权
    集成设备和包装与应力减少特性

    公开(公告)号：US20150181697A1

    公开(公告)日：2015-06-25

    申请号：US14577128

    申请日：2014-12-19

    Applicant: ANALOG DEVICES, INC.

    Inventor： Thomas M. Goida ,  Xiaojie Xue

    IPC: H05K1/02 ,  H05K1/18 ,  H01L21/78

    CPC classification number: H01L25/0657 ,  B81B7/0048 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

    Abstract: An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

    Abstract translation: 公开了一种集成器件管芯和封装。 集成器件裸片包括一体式。 整体可以具有包括一个或多个活性组分的上部部分。 上部可以具有限定上部的周边的至少一部分的第一和第二相对侧边，使得上部的上表面设置在第一和第二相对的侧面的上边缘之间。 整体也可以具有与上部一体地形成的下部。 下部可以包括从上部向下延伸的基座。 基座可以从第一和第二相对侧面的下边缘侧向插入。 基座可以包括配置成联接到托架的远端部分。

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