Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14478626Application Date: 2014-09-05
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Publication No.: US09343477B2Publication Date: 2016-05-17
- Inventor: Chin-Cheng Yang
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/311 ; H01L21/3213 ; H01L21/28

Abstract:
Provided is a semiconductor device including a substrate and a stack layer. The substrate includes a first region, a second region, and a third region. The third region is disposed between the first region and the second region. Since a top surface of the substrate in the first region is lower than the top surface of the substrate in the second region, the substrate in the third region has a first step height. The stack layer is disposed on the substrate in the first and third regions. The top surface of the stack layer in the first region and the third region and the top surface of the substrate in the second region are substantially coplanar.
Public/Granted literature
- US20160071867A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-03-10
Information query
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