Invention Grant
US09343574B2 Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack
有权
具有具有多电介质栅叠层的III-V族材料有源区的非平面半导体器件
- Patent Title: Non-planar semiconductor device having group III-V material active region with multi-dielectric gate stack
- Patent Title (中): 具有具有多电介质栅叠层的III-V族材料有源区的非平面半导体器件
-
Application No.: US14688410Application Date: 2015-04-16
-
Publication No.: US09343574B2Publication Date: 2016-05-17
- Inventor: Gilbert Dewey , Marko Radosavljevic , Ravi Pillarisetty , Benjamin Chu-Kung , Niloy Mukherjee
- Applicant: Gilbert Dewey , Marko Radosavljevic , Ravi Pillarisetty , Benjamin Chu-Kung , Niloy Mukherjee
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/78 ; B82Y10/00 ; H01L29/775 ; H01L29/06 ; H01L29/205 ; H01L29/40 ; H01L29/423 ; H01L29/51 ; H01L29/786 ; H01L29/201 ; B82Y99/00

Abstract:
Non-planar semiconductor devices having group III-V material active regions with multi-dielectric gate stacks are described. For example, a semiconductor device includes a hetero-structure disposed above a substrate. The hetero-structure includes a three-dimensional group III-V material body with a channel region. A source and drain material region is disposed above the three-dimensional group III-V material body. A trench is disposed in the source and drain material region separating a source region from a drain region, and exposing at least a portion of the channel region. A gate stack is disposed in the trench and on the exposed portion of the channel region. The gate stack includes first and second dielectric layers and a gate electrode.
Public/Granted literature
Information query
IPC分类: