Invention Grant
- Patent Title: Method for manufacturing mount assembly
- Patent Title (中): 制造安装组件的方法
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Application No.: US13871266Application Date: 2013-04-26
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Publication No.: US09343863B2Publication Date: 2016-05-17
- Inventor: Mikio Nakamura , Takanori Sekido
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2009-069076 20090319; JP2009-069077 20090319
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K3/34 ; H05K3/36
Abstract:
A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
Public/Granted literature
- US20130232781A1 MOUNT ASSEMBLY AND METHOD FOR MANUFACTURING MOUNT ASSEMBLY Public/Granted day:2013-09-12
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