Invention Grant
- Patent Title: Multi-layer thin film assembly and barrier film for electronic device including the same
- Patent Title (中): 多层薄膜组件和包括其的电子设备的阻挡膜
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Application No.: US13712209Application Date: 2012-12-12
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Publication No.: US09346242B2Publication Date: 2016-05-24
- Inventor: Kenichi Nagayama , Yukika Yamada , Hisanao Usami
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: JP2011-272327 20111213; KR10-2012-0098275 20120905
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B27/08 ; B05D7/00 ; H01L23/31 ; C09D183/08 ; B82Y30/00 ; C08G77/26
Abstract:
A multi-layer thin film assembly including a first layer including a first material, wherein the first material includes at least two kinds of functional groups, and a second layer disposed on the first layer and including a second material that interacts with the at least two kinds of functional groups, and a barrier film including the same.
Public/Granted literature
- US20130149517A1 MULTI-LAYER THIN FILM ASSEMBLY AND BARRIER FILM FOR ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2013-06-13
Information query
