Invention Grant
US09349663B2 Package-on-package structure having polymer-based material for warpage control
有权
包装封装结构，具有用于翘曲控制的聚合物基材料
- Patent Title: Package-on-package structure having polymer-based material for warpage control
- Patent Title (中): 包装封装结构，具有用于翘曲控制的聚合物基材料
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Application No.: US13539136Application Date: 2012-06-29
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Publication No.: US09349663B2Publication Date: 2016-05-24
- Inventor: Meng-Tse Chen , Yu-Chih Liu , Hui-Min Huang , Wei-Hung Lin , Jing Ruei Lu , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Meng-Tse Chen , Yu-Chih Liu , Hui-Min Huang , Wei-Hung Lin , Jing Ruei Lu , Ming-Da Cheng , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L25/065
Abstract:
A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component.
Public/Granted literature
- US20140001652A1 PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL Public/Granted day:2014-01-02
Information query
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