Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14669169Application Date: 2015-03-26
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Publication No.: US09355988B2Publication Date: 2016-05-31
- Inventor: Kenji Fujii , Yasumasa Kasuya , Mamoru Yamagami , Naoki Kinoshita , Motoharu Haga
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2014-079923 20140409; JP2014-079924 20140409; JP2014-079925 20140409; JP2015-056472 20150319
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/52 ; H01L23/00 ; H01L23/31 ; H01L23/29 ; H01L23/433 ; H01L23/482 ; H01L23/525
Abstract:
A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.
Public/Granted literature
- US20150294928A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-10-15
Information query
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