-
公开(公告)号:US09640455B2
公开(公告)日:2017-05-02
申请号:US15096792
申请日:2016-04-12
申请人: ROHM CO., LTD.
IPC分类号: H01L23/495 , H01L23/52 , H01L23/29 , H01L23/31 , H01L23/00 , H01L23/433 , H01L23/482 , H01L23/367 , H01L23/525
CPC分类号: H01L23/49527 , H01L23/291 , H01L23/293 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3675 , H01L23/4334 , H01L23/4822 , H01L23/49503 , H01L23/49548 , H01L23/49551 , H01L23/49568 , H01L23/49572 , H01L23/525 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/02311 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05181 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05582 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/1161 , H01L2224/11825 , H01L2224/13008 , H01L2224/13011 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13024 , H01L2224/13147 , H01L2224/13561 , H01L2224/13582 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/16014 , H01L2224/16245 , H01L2224/16258 , H01L2224/17107 , H01L2224/29008 , H01L2224/29082 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32245 , H01L2224/73253 , H01L2224/753 , H01L2224/75301 , H01L2224/75981 , H01L2224/81191 , H01L2224/81192 , H01L2224/81201 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/8146 , H01L2224/81464 , H01L2224/81466 , H01L2224/8183 , H01L2224/83191 , H01L2224/83201 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/8383 , H01L2224/92225 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/05042 , H01L2924/07025 , H01L2924/17724 , H01L2924/17747 , H01L2924/181 , H01L2924/182 , H01L2924/186 , H01L2924/00012 , H01L2924/00014 , H01L2224/05166 , H01L2924/01028 , H01L2924/0665
摘要: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.
-
公开(公告)号:US09355988B2
公开(公告)日:2016-05-31
申请号:US14669169
申请日:2015-03-26
申请人: ROHM CO., LTD.
IPC分类号: H01L23/495 , H01L23/52 , H01L23/00 , H01L23/31 , H01L23/29 , H01L23/433 , H01L23/482 , H01L23/525
CPC分类号: H01L23/49527 , H01L23/291 , H01L23/293 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3675 , H01L23/4334 , H01L23/4822 , H01L23/49503 , H01L23/49548 , H01L23/49551 , H01L23/49568 , H01L23/49572 , H01L23/525 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/02311 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05181 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05582 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/1161 , H01L2224/11825 , H01L2224/13008 , H01L2224/13011 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13024 , H01L2224/13147 , H01L2224/13561 , H01L2224/13582 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/16014 , H01L2224/16245 , H01L2224/16258 , H01L2224/17107 , H01L2224/29008 , H01L2224/29082 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32245 , H01L2224/73253 , H01L2224/753 , H01L2224/75301 , H01L2224/75981 , H01L2224/81191 , H01L2224/81192 , H01L2224/81201 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/8146 , H01L2224/81464 , H01L2224/81466 , H01L2224/8183 , H01L2224/83191 , H01L2224/83201 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/8383 , H01L2224/92225 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/05042 , H01L2924/07025 , H01L2924/17724 , H01L2924/17747 , H01L2924/181 , H01L2924/182 , H01L2924/186 , H01L2924/00012 , H01L2924/00014 , H01L2224/05166 , H01L2924/01028 , H01L2924/0665
摘要: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.
摘要翻译: 半导体器件具有设置有功能表面的半导体元件,功能电路形成在其上,并且背面面向与功能表面相反的方向,同时还具有支撑半导体元件并与半导体元件电连接的引线 以及覆盖半导体元件和引线的至少一部分的树脂封装。 半导体元件具有形成在功能面上的功能面侧电极,其具有在功能面朝向的方向突出的功能面侧凸起部。 功能面侧电极的功能面侧隆起部通过固态接合而与引线接合。
-
公开(公告)号:US09899300B2
公开(公告)日:2018-02-20
申请号:US15465427
申请日:2017-03-21
申请人: ROHM CO., LTD.
IPC分类号: H01L23/00 , H01L23/31 , H01L23/495
CPC分类号: H01L23/49527 , H01L23/291 , H01L23/293 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3675 , H01L23/4334 , H01L23/4822 , H01L23/49503 , H01L23/49548 , H01L23/49551 , H01L23/49568 , H01L23/49572 , H01L23/525 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/02311 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05181 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05582 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/1161 , H01L2224/11825 , H01L2224/13008 , H01L2224/13011 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13024 , H01L2224/13147 , H01L2224/13561 , H01L2224/13582 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/16014 , H01L2224/16245 , H01L2224/16258 , H01L2224/17107 , H01L2224/29008 , H01L2224/29082 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32245 , H01L2224/73253 , H01L2224/753 , H01L2224/75301 , H01L2224/75981 , H01L2224/81191 , H01L2224/81192 , H01L2224/81201 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/8146 , H01L2224/81464 , H01L2224/81466 , H01L2224/8183 , H01L2224/83191 , H01L2224/83201 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/8383 , H01L2224/92225 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/05042 , H01L2924/07025 , H01L2924/17724 , H01L2924/17747 , H01L2924/181 , H01L2924/182 , H01L2924/186 , H01L2924/00012 , H01L2924/00014 , H01L2224/05166 , H01L2924/01028 , H01L2924/0665
摘要: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.
-
-