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    Electronic device and mounting structure of the same
    1.
    发明授权
    Electronic device and mounting structure of the same 有权

    公开(公告)号：US10192845B2

    公开(公告)日：2019-01-29

    申请号：US15905324

    申请日：2018-02-26

    Applicant: ROHM CO., LTD.

    Inventor： Hiroaki Matsubara ,  Yasumasa Kasuya ,  Taro Nishioka

    IPC: H01L23/48 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

    Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

    Semiconductor device
    3.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US12165960B2

    公开(公告)日：2024-12-10

    申请号：US18324424

    申请日：2023-05-26

    Applicant: ROHM CO., LTD.

    Inventor： Hiroaki Matsubara ,  Yasumasa Kasuya

    IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/64 ,  H01L23/31

    Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.

    Electronic device and mounting structure of the same
    4.
    发明授权
    Electronic device and mounting structure of the same 有权

    公开(公告)号：US10790258B2

    公开(公告)日：2020-09-29

    申请号：US16217605

    申请日：2018-12-12

    Applicant: ROHM CO., LTD.

    Inventor： Hiroaki Matsubara ,  Yasumasa Kasuya ,  Taro Nishioka

    IPC: H01L23/495 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31 ,  H01L21/48

    Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

    Semiconductor device and method for manufacturing the same
    5.
    发明授权
    Semiconductor device and method for manufacturing the same 有权

    公开(公告)号：US10366948B2

    公开(公告)日：2019-07-30

    申请号：US15393318

    申请日：2016-12-29

    Applicant: ROHM CO., LTD.

    Inventor： Yasumasa Kasuya

    IPC: H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L23/495 ,  H01L21/56

    Abstract: A semiconductor device 1 includes a semiconductor chip 2, a plurality of leads 4, disposed in a periphery of the semiconductor chip 2, and a sealing resin 5, sealing the semiconductor chip 2 and the leads 4 such that lower surfaces 18 and outer end surfaces 20 at sides opposite the semiconductor chip 2 of the leads 4 are exposed. Lead plating layers 21 arranged to improve solder wettability are formed on the lower surfaces 18 and the outer end surfaces 20 of the leads 4.

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