Invention Grant
US09355989B2 Wire bonding device and method of eliminating defective bonding wire
有权
引线接合装置及消除不良接合线的方法
- Patent Title: Wire bonding device and method of eliminating defective bonding wire
- Patent Title (中): 引线接合装置及消除不良接合线的方法
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Application No.: US14584463Application Date: 2014-12-29
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Publication No.: US09355989B2Publication Date: 2016-05-31
- Inventor: Wei-Sheng Lin , Lien-Chen Chiang , Lung-Tang Hung , Meng-Hung Yeh , Yude Chu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103131301A 20140911
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/00 ; B23K20/00
Abstract:
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.
Public/Granted literature
- US20160079198A1 WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE Public/Granted day:2016-03-17
Information query
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