公开(公告)号：US09355989B2

公开(公告)日：2016-05-31

申请号：US14584463

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Sheng Lin ,  Lien-Chen Chiang ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Yude Chu

IPC: H01L23/49 ,  H01L23/00 ,  B23K20/00

CPC classification number: H01L24/43 ,  B23K20/004 ,  B23K20/007 ,  B23K20/233 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/42 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/437 ,  H01L2224/43985 ,  H01L2224/45144 ,  H01L2224/85045 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/3701 ,  H01L2924/386 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01079 ,  H01L2224/05599

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。

公开(公告)号：US20140191393A1

公开(公告)日：2014-07-10

申请号：US14086599

申请日：2013-11-21

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Lung-Tang Hung ,  Wei-Sheng Lin ,  Meng-Hung Yeh

IPC: H01L23/00

CPC classification number: H01L23/293 ,  H01L23/3121 ,  H01L23/564 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/16501 ,  H01L2224/16503 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48505 ,  H01L2224/48507 ,  H01L2224/4852 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/81191 ,  H01L2224/81424 ,  H01L2224/8181 ,  H01L2224/85424 ,  H01L2224/8581 ,  H01L2224/97 ,  H01L2924/00015 ,  H01L2924/181 ,  H01L2924/365 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0583 ,  H01L2924/01013 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor package is provided, including a carrier having electrical connecting pads, a semiconductor element disposed on the carrier and having electrode pads, conductive elements electrically connected to the electrode pads and the electrical connecting pads, fluorine ions formed between the conductive elements and the electrode pads or between the conductive elements and the electrical connecting pads, and an encapsulant formed on the carrier and the conductive elements, wherein the electrode pads or the electrical connecting pads are formed by aluminum materials to form fluorine aluminum by way of packaging the fluorine ions after the completion of the packaging process. Accordingly, the corrosion resistance of the semiconductor package is increased.

Abstract translation: 提供了一种半导体封装，包括具有电连接焊盘的载体，设置在载体上的半导体元件，并具有电极焊盘，电连接到电极焊盘的导电元件和电连接焊盘，形成在导电元件和电极之间的氟离子 衬垫或导电元件与电连接焊盘之间，以及形成在载体和导电元件上的密封剂，其中电极焊盘或电连接焊盘由铝材料形成，以通过在氟化铝之后包装氟离子形成氟铝 完成包装过程。 因此，半导体封装的耐腐蚀性提高。

公开(公告)号：US09289846B2

公开(公告)日：2016-03-22

申请号：US14085981

申请日：2013-11-21

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Wei-Sheng Lin ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Zhi-Lun Hsieh ,  Yude Chu

IPC: B23K31/02 ,  B23K20/00 ,  H01L23/00

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4848 ,  H01L2224/85012 ,  H01L2224/85051 ,  H01L2224/8517 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract translation: 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。

公开(公告)号：US20160079198A1

公开(公告)日：2016-03-17

申请号：US14584463

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Sheng Lin ,  Lien-Chen Chiang ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Yude Chu

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/43 ,  B23K20/004 ,  B23K20/007 ,  B23K20/233 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/42 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/437 ,  H01L2224/43985 ,  H01L2224/45144 ,  H01L2224/85045 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/3701 ,  H01L2924/386 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01079 ,  H01L2224/05599

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。

公开(公告)号：US20150028081A1

公开(公告)日：2015-01-29

申请号：US14085981

申请日：2013-11-21

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD

Inventor： Wei-Sheng Lin ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Zhi-Lun Hsieh ,  Yude Chu

IPC: B23K20/10

CPC classification number: B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4848 ,  H01L2224/85012 ,  H01L2224/85051 ,  H01L2224/8517 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract translation: 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。