公开(公告)号：US20160126176A1

公开(公告)日：2016-05-05

申请号：US14837841

申请日：2015-08-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tso-Chia Chang ,  Cheng-Yu Hsieh ,  Lien-Chen Chiang ,  Fu-Tang Huang

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A package substrate is provided, which includes: a body having opposite first and second surfaces, each having adjacent first and second regions defined thereon; first and second circuit layers formed on the first and second surfaces of the body, respectively; a first insulating layer formed on the first surface of the body and having a plurality of first openings formed in the first insulating layer and positioned in the first and second regions; and a second insulating layer formed on the second surface of the body and having a plurality of second openings formed in the second insulating layer and positioned in the second region. Further, at least a third opening is formed in the second insulating layer and positioned in the first region to reduce the volume of the second insulating layer, thereby facilitating even distribution of thermal stresses through the first and second insulating layers during thermal cycling and hence preventing warpage of the package substrate.

Abstract translation: 提供封装基板，其包括：具有相对的第一和第二表面的主体，每个具有限定在其上的相邻的第一和第二区域; 分别形成在主体的第一和第二表面上的第一和第二电路层; 第一绝缘层，形成在所述主体的第一表面上，并且具有形成在所述第一绝缘层中并位于所述第一和第二区域中的多个第一开口; 以及形成在所述主体的第二表面上并且具有形成在所述第二绝缘层中并位于所述第二区域中的多个第二开口的第二绝缘层。 此外，在第二绝缘层中形成至少第三开口并且定位在第一区域中以减小第二绝缘层的体积，从而有助于在热循环期间通过第一绝缘层和第二绝缘层的热应力的均匀分布，并因此防止 封装基板翘曲。

公开(公告)号：US20160079198A1

公开(公告)日：2016-03-17

申请号：US14584463

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Sheng Lin ,  Lien-Chen Chiang ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Yude Chu

IPC: H01L23/00 ,  B23K20/00

CPC classification number: H01L24/43 ,  B23K20/004 ,  B23K20/007 ,  B23K20/233 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/42 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/437 ,  H01L2224/43985 ,  H01L2224/45144 ,  H01L2224/85045 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/3701 ,  H01L2924/386 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01079 ,  H01L2224/05599

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。

公开(公告)号：US09355989B2

公开(公告)日：2016-05-31

申请号：US14584463

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wei-Sheng Lin ,  Lien-Chen Chiang ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Yude Chu

IPC: H01L23/49 ,  H01L23/00 ,  B23K20/00

CPC classification number: H01L24/43 ,  B23K20/004 ,  B23K20/007 ,  B23K20/233 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/42 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/437 ,  H01L2224/43985 ,  H01L2224/45144 ,  H01L2224/85045 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/3701 ,  H01L2924/386 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01079 ,  H01L2224/05599

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract translation: 提供一种消除缺陷接合线的方法，包括如果接合部件的接合线有缺陷，则将接合部件从载体的第一区域移动到载体的第二区域，并且协作地操作移动部件和接合 从而导致不良接合线从接合部件移除并结合到载体的第二区域，从而自动调试接合部件并提高生产效率。

公开(公告)号：US20160141217A1

公开(公告)日：2016-05-19

申请号：US14695066

申请日：2015-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Pei-Lin Chen ,  Lien-Chen Chiang

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3185 ,  H01L25/0655 ,  H01L2224/16225

Abstract: A method for fabricating an electronic package, including the steps of: providing a substrate having a plurality of electronic elements and a plurality of separation portions formed between the electronic elements, wherein each of the electronic elements has an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; forming at least an opening in each of the separation portions from a side corresponding to the inactive surfaces of the electronic elements, wherein the at least an opening does not penetrate the separation portion; forming an encapsulant in the opening; and singulating the electronic elements along the opening from a side corresponding to the active surfaces of the electronic elements. As such, each of the electronic elements has a side surface adjacent to and connecting the active and inactive surfaces of the electronic element and the side surface is partially covered by the encapsulant for protection.

Abstract translation: 一种制造电子封装的方法，包括以下步骤：提供具有多个电子元件的基板和形成在电子元件之间的多个分离部分，其中每个电子元件具有多个电极焊盘 和与活性表面相反的非活性表面; 在与所述电子元件的非活性表面相对应的一侧形成每个所述分离部分中的至少一个开口，其中所述至少一个开口不穿透所述分离部分; 在开口中形成密封剂; 并且从对应于电子元件的有源表面的一侧沿着开口分离电子元件。 因此，每个电子元件具有与电子元件的有源和非活性表面相邻并连接的侧表面，并且侧表面部分地被密封剂覆盖以用于保护。