Invention Grant
- Patent Title: Coefficient of thermal expansion compensating compliant component
- Patent Title (中): 热膨胀系数适应元件
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Application No.: US13870414Application Date: 2013-04-25
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Publication No.: US09357634B2Publication Date: 2016-05-31
- Inventor: John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
- Applicant: KEMET Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Perkins Law Firm, LLC
- Agent Joseph T. Guy
- Main IPC: H05K7/04
- IPC: H05K7/04 ; H01L23/49 ; H05K1/02 ; H05K3/30 ; H01G4/38 ; H01C1/014 ; H01C1/14 ; H01C7/18 ; H01G2/06 ; H01G4/232 ; H05K1/18

Abstract:
An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Public/Granted literature
- US20130284501A1 COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT Public/Granted day:2013-10-31
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