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公开(公告)号：US20130284501A1
公开(公告)日：2013-10-31
申请号：US13870414
申请日：2013-04-25
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
CPC classification number: H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框架的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。
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公开(公告)号：US10229785B2
公开(公告)日：2019-03-12
申请号：US14096605
申请日：2013-12-04
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey W. Bell
Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
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公开(公告)号：US09357634B2
公开(公告)日：2016-05-31
申请号：US13870414
申请日：2013-04-25
Applicant: KEMET Electronics Corporation
Inventor： John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
IPC: H05K7/04 , H01L23/49 , H05K1/02 , H05K3/30 , H01G4/38 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H05K1/18
CPC classification number: H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框架的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。
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公开(公告)号：US20140160624A1
公开(公告)日：2014-06-12
申请号：US14096605
申请日：2013-12-04
Applicant: Kemet Electronics Corporation
Inventor： John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey W. Bell
CPC classification number: H01G4/30 , H01G4/232 , H01G4/38 , H01G13/006 , Y10T29/43
Abstract: An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
Abstract translation: 提供了一种利用堆叠MLCC的改进的电容器。 所述电容器包括夹在第一引线和第二引线之间的至少一个MLCC。 每个引线包括至少一个整体引线压接。
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