Invention Grant
- Patent Title: Joining sheet, electronic component, and producing method thereof
- Patent Title (中): 接合片，电子部件及其制造方法
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Application No.: US13804376Application Date: 2013-03-14
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Publication No.: US09357645B2Publication Date: 2016-05-31
- Inventor: Hirofumi Ebe , Yoshihiro Furukawa
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2012-072147 20120327
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/32 ; H05K3/36 ; B23K35/24 ; H05K1/11 ; H05K13/04
Abstract:
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
Public/Granted literature
- US20130258632A1 JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF Public/Granted day:2013-10-03
Information query
