Invention Grant
- Patent Title: Substrate cleaning method, substrate cleaning system and program storage medium
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Application No.: US13709331Application Date: 2012-12-10
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Publication No.: US09358588B2Publication Date: 2016-06-07
- Inventor: Tsukasa Watanabe , Naoki Shindo , Takahiro Furukawa , Yuji Kamikawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell LLP.
- Priority: JP2006-070538 20060315
- Main IPC: B08B3/12
- IPC: B08B3/12 ; B01F15/00 ; B01F15/04 ; B08B3/00 ; C11D11/00 ; H01L21/67

Abstract:
The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.
Public/Granted literature
- US20130152964A1 SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND PROGRAM STORAGE MEDIUM Public/Granted day:2013-06-20
Information query
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