Invention Grant
- Patent Title: Method of forming a magnetic tunnel junction device
- Patent Title (中): 形成磁隧道结装置的方法
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Application No.: US14294205Application Date: 2014-06-03
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Publication No.: US09368718B2Publication Date: 2016-06-14
- Inventor: Xia Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Donald D. Min; Paul Holdaway
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L43/12 ; B82Y25/00 ; B82Y40/00 ; G11C11/16 ; G11C11/56 ; H01F41/30 ; H01L43/08 ; H01F10/32 ; H01L27/22

Abstract:
A method of forming a magnetic tunnel junction device is disclosed that includes forming a trench in a substrate, the trench including a plurality of sidewalls and a bottom wall. The method includes depositing a first conductive material within the trench proximate to one of the sidewalls and depositing a second conductive material within the trench. The method further includes depositing a material to form a magnetic tunnel junction (MTJ) structure within the trench. The MTJ structure includes a fixed magnetic layer having a magnetic field with a fixed magnetic orientation, a tunnel junction layer, and a free magnetic layer having a magnetic field with a configurable magnetic orientation. The method further includes selectively removing a portion of the MTJ structure to create an opening in the MTJ structure.
Public/Granted literature
- US20140273288A1 METHOD OF FORMING A MAGNETIC TUNNEL JUNCTION DEVICE Public/Granted day:2014-09-18
Information query
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