Invention Grant
- Patent Title: Die level chemical mechanical polishing
- Patent Title (中): 模具级化学机械抛光
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Application No.: US14259657Application Date: 2014-04-23
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Publication No.: US09373524B2Publication Date: 2016-06-21
- Inventor: Rishikesh Krishnan , Rajasekhar Venigalla
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/321 ; B24B37/04 ; B24B37/20 ; H01L21/3105
Abstract:
A method of polishing a wafer at the die level with a targeted slurry delivery system. The wafer is placed on a wafer carrier exposing the top side of the wafer, the wafer contains a die. The polishing apparatus will polish a portion of the die using a pad that is smaller than the die and the pad is located above the die. A slurry is applied to a portion of the die being polished. Embodiments of the invention provide multiple pads working on the same die.
Public/Granted literature
- US20150311088A1 DIE LEVEL CHEMICAL MECHANICAL POLISHING Public/Granted day:2015-10-29
Information query
IPC分类:
