Invention Grant
- Patent Title: Bump package and methods of formation thereof
- Patent Title (中): 凹凸包装及其形成方法
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Application No.: US13655228Application Date: 2012-10-18
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Publication No.: US09373609B2Publication Date: 2016-06-21
- Inventor: Meng Tong Ong , Thiam Huat Lim , Kok Chai Goh
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L25/00 ; H01L25/07 ; H01L25/16 ; H01L21/78 ; H01L23/00
Abstract:
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a contact pad on a major surface. The bump is disposed on the contact pad of the semiconductor chip. A solder layer is disposed on sidewalls of the bump.
Public/Granted literature
- US20140110835A1 Bump Package and Methods of Formation Thereof Public/Granted day:2014-04-24
Information query
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