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公开(公告)号：US09373609B2
公开(公告)日：2016-06-21
申请号：US13655228
申请日：2012-10-18
Applicant: Infineon Technologies AG
Inventor： Meng Tong Ong , Thiam Huat Lim , Kok Chai Goh
CPC classification number: H01L25/50 , H01L21/78 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/92 , H01L24/96 , H01L25/072 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/11003 , H01L2224/1112 , H01L2224/114 , H01L2224/1161 , H01L2224/11826 , H01L2224/13006 , H01L2224/13019 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13171 , H01L2224/13562 , H01L2224/1357 , H01L2224/13611 , H01L2224/13618 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/13669 , H01L2224/1403 , H01L2224/14181 , H01L2224/14505 , H01L2224/24101 , H01L2224/24137 , H01L2224/2518 , H01L2224/27003 , H01L2224/2712 , H01L2224/274 , H01L2224/2761 , H01L2224/27826 , H01L2224/28105 , H01L2224/29006 , H01L2224/29019 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29171 , H01L2224/29562 , H01L2224/2957 , H01L2224/29611 , H01L2224/29618 , H01L2224/29639 , H01L2224/29644 , H01L2224/29655 , H01L2224/29669 , H01L2224/3003 , H01L2224/30181 , H01L2224/30505 , H01L2224/92133 , H01L2224/92135 , H01L2224/94 , H01L2224/96 , H01L2924/01322 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01082 , H01L2224/11 , H01L2224/27 , H01L2224/82
Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a contact pad on a major surface. The bump is disposed on the contact pad of the semiconductor chip. A solder layer is disposed on sidewalls of the bump.
Abstract translation: 根据本发明的实施例，半导体封装包括半导体芯片和凸块。 半导体芯片在主表面上具有接触焊盘。 凸块设置在半导体芯片的接触焊盘上。 焊料层设置在凸块的侧壁上。
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公开(公告)号：US20140110835A1
公开(公告)日：2014-04-24
申请号：US13655228
申请日：2012-10-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Meng Tong Ong , Thiam Huat Lim , Kok Chai Goh
CPC classification number: H01L25/50 , H01L21/78 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/92 , H01L24/96 , H01L25/072 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/11003 , H01L2224/1112 , H01L2224/114 , H01L2224/1161 , H01L2224/11826 , H01L2224/13006 , H01L2224/13019 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13171 , H01L2224/13562 , H01L2224/1357 , H01L2224/13611 , H01L2224/13618 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/13669 , H01L2224/1403 , H01L2224/14181 , H01L2224/14505 , H01L2224/24101 , H01L2224/24137 , H01L2224/2518 , H01L2224/27003 , H01L2224/2712 , H01L2224/274 , H01L2224/2761 , H01L2224/27826 , H01L2224/28105 , H01L2224/29006 , H01L2224/29019 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29171 , H01L2224/29562 , H01L2224/2957 , H01L2224/29611 , H01L2224/29618 , H01L2224/29639 , H01L2224/29644 , H01L2224/29655 , H01L2224/29669 , H01L2224/3003 , H01L2224/30181 , H01L2224/30505 , H01L2224/92133 , H01L2224/92135 , H01L2224/94 , H01L2224/96 , H01L2924/01322 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01082 , H01L2224/11 , H01L2224/27 , H01L2224/82
Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip and a bump. The semiconductor chip has a contact pad on a major surface. The bump is disposed on the contact pad of the semiconductor chip. A solder layer is disposed on sidewalls of the bump.
Abstract translation: 根据本发明的实施例，半导体封装包括半导体芯片和凸块。 半导体芯片在主表面上具有接触焊盘。 凸块设置在半导体芯片的接触焊盘上。 焊料层设置在凸块的侧壁上。
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