Invention Grant
- Patent Title: Three-dimensional transistor with improved channel mobility
- Patent Title (中): 具有改善信道移动性的三维晶体管
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Application No.: US14052977Application Date: 2013-10-14
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Publication No.: US09373720B2Publication Date: 2016-06-21
- Inventor: Stefan Flachowsky , Jan Hoentschel , Ralf Richter , Peter Javorka
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/66

Abstract:
The present invention relates to a semiconductor structure comprising at least a first and a second three-dimensional transistor, wherein the first transistor and the second transistor are electrically connected in parallel to each other, and wherein each transistor comprises a source and a drain, wherein the source and/or drain of the first transistor is at least partially separated from, respectively, the source and/or drain of the second transistor. The invention further relates to a process for realizing such a semiconductor structure.
Public/Granted literature
- US20150102426A1 THREE-DIMENSIONAL TRANSISTOR WITH IMPROVED CHANNEL MOBILITY Public/Granted day:2015-04-16
Information query
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