发明授权
- 专利标题： Substrate processing apparatus and substrate processing method
- 专利标题（中）： 基板加工装置及基板处理方法
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申请号： US13943198申请日： 2013-07-16
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公开(公告)号： US09375748B2公开(公告)日： 2016-06-28
- 发明人: Masahiko Harumoto , Tadashi Miyagi , Yukihiko Inagaki , Koji Kaneyama
- 申请人： Masahiko Harumoto , Tadashi Miyagi , Yukihiko Inagaki , Koji Kaneyama
- 申请人地址： JP
- 专利权人： SCREEN Semiconductor Solutions Co., Ltd.
- 当前专利权人： SCREEN Semiconductor Solutions Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Ostrolenk Faber LLP
- 优先权： JP2012-159917 20120718
- 主分类号： G03D5/00
- IPC分类号： G03D5/00 ; B05C11/00 ; H01J37/02 ; H01L21/033 ; H01L21/67 ; G03F7/00 ; G03F7/16 ; G03F7/30
摘要：
An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
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