Invention Grant
US09377423B2 Systems and methods for handling substrates at below dew point temperatures
有权
在低于露点温度下处理基材的系统和方法
- Patent Title: Systems and methods for handling substrates at below dew point temperatures
- Patent Title (中): 在低于露点温度下处理基材的系统和方法
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Application No.: US14141781Application Date: 2013-12-27
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Publication No.: US09377423B2Publication Date: 2016-06-28
- Inventor: Botho Hirschfeld , Axel Becker
- Applicant: Cascade Microtech, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Dascenzo Intellectual Property Law, P.C.
- Main IPC: G01N25/66
- IPC: G01N25/66 ; G01R31/00 ; G01R31/28

Abstract:
Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.
Public/Granted literature
- US20140185649A1 SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURES Public/Granted day:2014-07-03
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