Invention Grant
US09377423B2 Systems and methods for handling substrates at below dew point temperatures 有权
在低于露点温度下处理基材的系统和方法

Systems and methods for handling substrates at below dew point temperatures
Abstract:
Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.
Information query
Patent Agency Ranking
0/0