Invention Grant
- Patent Title: Semiconductor device and manufacturing method of semiconductor device
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Application No.: US14745340Application Date: 2015-06-19
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Publication No.: US09379127B2Publication Date: 2016-06-28
- Inventor: Koichi Toba , Yasushi Ishii , Hiraku Chakihara , Kota Funayama , Yoshiyuki Kawashima , Takashi Hashimoto
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2010-262394 20101125
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/115 ; H01L21/28 ; H01L29/423

Abstract:
A semiconductor device with a nonvolatile memory is provided which has improved characteristics. The semiconductor device includes a control gate electrode, a memory gate electrode disposed adjacent to the control gate electrode, a first insulating film, and a second insulating film including therein a charge storing portion. Among these components, the memory gate electrode is formed of a silicon film including a first silicon region positioned over the second insulating film, and a second silicon region positioned above the first silicon region. The second silicon region contains p-type impurities, and the concentration of p-type impurities of the first silicon region is lower than that of the p-type impurities of the second silicon region.
Public/Granted literature
- US20150287736A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2015-10-08
Information query
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