Invention Grant
US09379283B2 Method of manufacturing nanostructure semiconductor light emitting device by forming nanocores into openings
有权
通过将纳米孔形成开口来制造纳米结构半导体发光器件的方法
- Patent Title: Method of manufacturing nanostructure semiconductor light emitting device by forming nanocores into openings
- Patent Title (中): 通过将纳米孔形成开口来制造纳米结构半导体发光器件的方法
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Application No.: US14165112Application Date: 2014-01-27
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Publication No.: US09379283B2Publication Date: 2016-06-28
- Inventor: Nam Goo Cha , Geon Wook Yoo , Han Kyu Seong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0010110 20130129
- Main IPC: H01L33/20
- IPC: H01L33/20 ; H01L33/00 ; H01L33/18 ; H01L33/24

Abstract:
A method of manufacturing a nanostructure semiconductor light emitting device including providing a base layer formed of a first conductivity type semiconductor. A mask including an etch stop layer is formed on the base layer. A plurality of openings are formed in the mask so as to expose regions of. A plurality of nanocores are formed by growing the first conductivity type semiconductor on the exposed regions of the base layer to fill the plurality of openings. The mask is partially removed by using the etch stop layer to expose side portions of the plurality of nanocores. An active layer and a second conductivity type semiconductor layer are sequentially grown on surfaces of the plurality of nanocores.
Public/Granted literature
- US20140209859A1 NANOSTRUCTURE SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-07-31
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