Invention Grant
US09379288B2 Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting device package using the same 有权
半导体发光器件及其制造方法以及使用其的半导体发光器件封装

Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting device package using the same
Abstract:
There is provided a semiconductor light emitting device comprising a semiconductor stack having first and second main surfaces opposing each other, and comprising first and second conductivity-type semiconductor layers respectively defining the first and second main surfaces, and an active layer interposed between the first and second conductivity-type semiconductor layers; a plurality of contact holes penetrating the second conductivity-type semiconductor layer and the active layer, and one region of the first conductivity-type semiconductor layer; a first electrode layer disposed on the second main surface of the semiconductor stack, the first electrode layer extending and being connected to the one region of the first conductivity-type semiconductor layer through the contact holes; a second electrode layer disposed between the semiconductor stack and the first electrode layer and connected to the second conductivity-type semiconductor layer; and first and second interconnected bumps.
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