Invention Grant
- Patent Title: Semiconductor light emitting device, manufacturing method thereof, and semiconductor light emitting device package using the same
- Patent Title (中): 半导体发光器件及其制造方法以及使用其的半导体发光器件封装
-
Application No.: US14615116Application Date: 2015-02-05
-
Publication No.: US09379288B2Publication Date: 2016-06-28
- Inventor: Pun Jae Choi , Jae In Sim , Seok Min Hwang , Jin Hyun Lee , Myong Soo Cho , Ki Yeol Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0105365 20071019
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L33/38 ; H01L33/20 ; H01L33/40 ; H01L33/22 ; H01L33/46 ; H01L33/62 ; H01L23/00

Abstract:
There is provided a semiconductor light emitting device comprising a semiconductor stack having first and second main surfaces opposing each other, and comprising first and second conductivity-type semiconductor layers respectively defining the first and second main surfaces, and an active layer interposed between the first and second conductivity-type semiconductor layers; a plurality of contact holes penetrating the second conductivity-type semiconductor layer and the active layer, and one region of the first conductivity-type semiconductor layer; a first electrode layer disposed on the second main surface of the semiconductor stack, the first electrode layer extending and being connected to the one region of the first conductivity-type semiconductor layer through the contact holes; a second electrode layer disposed between the semiconductor stack and the first electrode layer and connected to the second conductivity-type semiconductor layer; and first and second interconnected bumps.
Public/Granted literature
Information query
IPC分类: