发明授权
- 专利标题： Electronic device and manufacturing method thereof
- 专利标题（中）： 电子装置及其制造方法
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申请号： US14294164申请日： 2014-06-03
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公开(公告)号： US09381573B2公开(公告)日： 2016-07-05
- 发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- 申请人： CYNTEC CO., LTD.
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC Co., Ltd.
- 当前专利权人： CYNTEC Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Litron Patent and Trademark Office
- 代理商 Min-Lee Teng
- 优先权： TW98116158A 20090515
- 主分类号： H01F27/24
- IPC分类号： H01F27/24 ; B22F3/12 ; H01F17/04 ; H01F27/255 ; H01F41/02 ; H01F27/28 ; H05K1/18 ; B22F5/00 ; B22F7/08 ; H01F1/22 ; H01F27/29
摘要：
An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.
公开/授权文献
- US20140266533A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2014-09-18
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