Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
- Patent Title (中): 电子装置及其制造方法
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Application No.: US14294164Application Date: 2014-06-03
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Publication No.: US09381573B2Publication Date: 2016-07-05
- Inventor: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC Co., Ltd.
- Current Assignee: CYNTEC Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent and Trademark Office
- Agent Min-Lee Teng
- Priority: TW98116158A 20090515
- Main IPC: H01F27/24
- IPC: H01F27/24 ; B22F3/12 ; H01F17/04 ; H01F27/255 ; H01F41/02 ; H01F27/28 ; H05K1/18 ; B22F5/00 ; B22F7/08 ; H01F1/22 ; H01F27/29
Abstract:
An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.
Public/Granted literature
- US20140266533A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-09-18
Information query
