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公开(公告)号：US20150021083A1
公开(公告)日：2015-01-22
申请号：US14507847
申请日：2014-10-07
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255 , H05K1/18 , H01F27/28
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
摘要翻译： 一种电子设备，包括第一磁粉; 第二磁性粉末，其中所述第一磁性粉末的平均粒径大于所述第二磁性粉末的平均粒径，所述第一磁性粉末的维氏硬度比所述第二磁性粉末的维氏硬度大 硬度差异，第一磁粉与第二磁粉混合; 以及埋入第一磁粉和第二磁粉的混合物中的导线; 其中，通过第一磁性粉末和第二磁性粉末的第一硬度差，将第一磁性粉末和第二磁性粉末的混合物以及埋入其中的导线组合在一起形成一体的磁性体，其温度低于 导线的熔点。
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公开(公告)号：US10658102B2
公开(公告)日：2020-05-19
申请号：US16451035
申请日：2019-06-25
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/24 , H01F27/255 , H01F5/00 , H01F17/04 , H01F41/02 , H01F27/28 , H05K1/18 , B22F3/12 , B22F5/00 , B22F7/08 , H01F1/22 , B22F3/16 , H01F27/32 , H01F27/29
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
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公开(公告)号：US10204730B2
公开(公告)日：2019-02-12
申请号：US15283451
申请日：2016-10-03
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/32 , H01F5/00 , H01F27/255 , H01F27/24 , H01F17/04 , H01F41/02 , H01F27/28 , H05K1/18 , B22F3/12 , B22F5/00 , B22F7/08 , H01F1/22 , B22F3/16 , H01F27/29
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
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公开(公告)号：US09000879B2
公开(公告)日：2015-04-07
申请号：US14507847
申请日：2014-10-07
申请人： CYNTEC Co., Ltd.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/24 , B22F3/12 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/255 , H01F27/28 , H01F41/02 , H05K1/18 , H01F27/29
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
摘要翻译： 一种电子设备，包括第一磁粉; 第二磁性粉末，其中所述第一磁性粉末的平均粒径大于所述第二磁性粉末的平均粒径，所述第一磁性粉末的维氏硬度比所述第二磁性粉末的维氏硬度大 硬度差异，第一磁粉与第二磁粉混合; 以及埋入第一磁粉和第二磁粉的混合物中的导线; 其中，通过第一磁性粉末和第二磁性粉末的第一硬度差，将第一磁性粉末和第二磁性粉末的混合物以及埋入其中的导线组合在一起形成一体的磁性体，其温度低于 导线的熔点。
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公开(公告)号：US20170025216A1
公开(公告)日：2017-01-26
申请号：US15283451
申请日：2016-10-03
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F5/00 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
摘要翻译： 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。
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公开(公告)号：US09481037B2
公开(公告)日：2016-11-01
申请号：US14507849
申请日：2014-10-07
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： B22F3/12 , H01F27/24 , H01F17/04 , H01F27/255 , H01F41/02 , H01F27/28 , H05K1/18 , B22F5/00 , B22F7/08 , H01F1/22 , H01F27/29
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
摘要翻译： 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。
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公开(公告)号：US09381573B2
公开(公告)日：2016-07-05
申请号：US14294164
申请日：2014-06-03
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/24 , B22F3/12 , H01F17/04 , H01F27/255 , H01F41/02 , H01F27/28 , H05K1/18 , B22F5/00 , B22F7/08 , H01F1/22 , H01F27/29
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.
摘要翻译： 一种电子设备，包括第一磁粉; 第二磁性粉末，其中所述第一磁性粉末的平均粒径大于所述第二磁性粉末的平均粒径，其中所述第一磁性粉末的平均粒径与所述第二磁性粉末的平均粒径之比 粉末大于2，第一磁粉与第二磁粉混合; 以及埋入第一磁粉和第二磁粉的混合物中的导线; 其中第一磁粉和第二磁粉的混合物和埋在其中的导线组合在一起，在低于导线熔点的温度下形成整体磁体。
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公开(公告)号：US20190311837A1
公开(公告)日：2019-10-10
申请号：US16451035
申请日：2019-06-25
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255 , H01F5/00 , H01F27/24 , H01F27/32 , B22F3/16 , H01F1/22 , B22F7/08 , H01F17/04 , B22F3/12 , H05K1/18 , H01F27/28 , H01F41/02 , B22F5/00
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
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公开(公告)号：US20150023829A1
公开(公告)日：2015-01-22
申请号：US14507849
申请日：2014-10-07
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
CPC分类号： H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
摘要翻译： 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。
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公开(公告)号：US20190148050A1
公开(公告)日：2019-05-16
申请号：US16248790
申请日：2019-01-16
申请人： CYNTEC CO., LTD.
发明人： Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号： H01F27/255 , B22F3/12 , H01F27/24 , B22F3/16 , H05K1/18 , H01F41/02 , H01F27/32 , H01F27/28 , H01F17/04 , H01F5/00 , H01F1/22 , B22F7/08 , B22F5/00
摘要： A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.
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