Invention Grant
- Patent Title: Pb-free solder and electronic component built-in module
- Patent Title (中): 无铅焊料和电子元器件内置模块
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Application No.: US14923853Application Date: 2015-10-27
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Publication No.: US09381595B2Publication Date: 2016-07-05
- Inventor: Tsutomu Yasui , Kenichi Kawabata
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-220090 20141029
- Main IPC: H05K1/09
- IPC: H05K1/09 ; B23K35/26 ; H05K1/11 ; H05K1/18 ; C22C13/02 ; C22C19/03 ; B23K35/02
Abstract:
A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %.
Public/Granted literature
- US20160121434A1 Pb-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE Public/Granted day:2016-05-05
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