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公开(公告)号：US09381595B2
公开(公告)日：2016-07-05
申请号：US14923853
申请日：2015-10-27
Applicant: TDK CORPORATION
Inventor： Tsutomu Yasui , Kenichi Kawabata
CPC classification number: B23K35/262 , B22F2998/10 , B23K35/0244 , C22C1/0433 , C22C1/0483 , C22C13/02 , C22C19/03 , H05K1/11 , H05K1/181 , H05K3/3463 , H05K3/3478 , H05K3/3494 , H05K2203/0415 , B22F1/0003 , B22F9/082 , B22F2201/01
Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %.
Abstract translation: 无铅焊料包括至少包含Sn和Bi的第一金属和至少包含Ni-Fe合金的第二金属。 在第一金属中，Sn和Bi的总和为90质量％以上，Bi的比例为5〜15质量％。 第二金属与第一金属的质量和第二金属的质量之和为5〜30质量％。
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公开(公告)号：US10362686B2
公开(公告)日：2019-07-23
申请号：US14862607
申请日：2015-09-23
Applicant: TDK CORPORATION
Inventor： Tsutomu Yasui , Hisayuki Abe , Kenichi Kawabata , Tomoko Kitamura
Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.
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公开(公告)号：US10253395B2
公开(公告)日：2019-04-09
申请号：US14923831
申请日：2015-10-27
Applicant: TDK CORPORATION
Inventor： Tsutomu Yasui , Kenichi Kawabata
Abstract: An electronic circuit module component includes: an electronic component; a circuit board including the electronic component mounted thereon; and a bonding metal disposed between a terminal electrode of the electronic component and a terminal electrode of the circuit board, and including Sn alloy phases, an Ni—Sn alloy phase that disperses and forms between the Sn alloy phases and includes at least Fe, and a plurality of holes that is formed inside the Ni—Sn alloy phase and has a diameter of 5 μm or less. A center distance between the holes adjacent to each other is 10 μm or more.
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