公开(公告)号：US11682508B2

公开(公告)日：2023-06-20

申请号：US16925633

申请日：2020-07-10

Applicant: TDK CORPORATION

Inventor： Masataka Kitagami ,  Kenichi Kawabata

IPC: H01F1/147 ,  H01F3/08 ,  H01F41/02 ,  B01J2/00

CPC classification number: H01F1/1475 ,  B01J2/006 ,  H01F3/08 ,  H01F41/026

Abstract: Disclosed herein is a composite magnetic powder that includes an iron-containing magnetic powder and an insulating layer comprising a silicon oxide formed on a surface of the iron-containing magnetic powder. The insulating layer contains pores, and an area ratio of the pores in a cross section of the insulating layer is 5% or less.

公开(公告)号：US09818518B2

公开(公告)日：2017-11-14

申请号：US15351701

申请日：2016-11-15

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01F1/20 ,  H01F1/147 ,  H05K9/00 ,  H01L23/10 ,  H01L23/18

CPC classification number: H01L23/10 ,  H01F1/14758 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/35121

Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/° C. or less.

公开(公告)号：US09439288B2

公开(公告)日：2016-09-06

申请号：US14091056

申请日：2013-11-26

Applicant: TDK Corporation

Inventor： Shuichi Takizawa ,  Kenichi Kawabata

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09118 ,  H05K2201/099 ,  Y02P70/611

Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.

Abstract translation: 电子模块设置有电路板2，表面安装在电路板2上的芯片部件3和密封芯片部件3的模具部件4.电路板2包括焊盘7和抗蚀剂图案8A，其部分地 芯片部件3具有底部电极6b和侧面电极6c。 抗蚀剂图案8A在平面图中具有与芯片部件3的底部电极6b重叠的重叠部分。 至少在抗蚀剂图案8A和第一焊料部分10a之间的第一间隙D1中填充模具构件4的一部分。

公开(公告)号：US09386697B2

公开(公告)日：2016-07-05

申请号：US14302946

申请日：2014-06-12

Applicant: TDK Corporation

Inventor： Hiroyuki Uematsu ,  Kenichi Kawabata

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/115 ,  H01L2224/04105 ,  H05K1/185 ,  H05K1/188 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/0187 ,  H05K2201/09563 ,  H05K2203/095 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.

Abstract translation: 布线基板或电子部件嵌入基板包括：基板，其具有含有多个填料的树脂; 以及通孔，其电连接到提供给基板的至少一个互连件，其中所述通孔包括混合区域，在所述混合区域中，在相对于所述基板的内径向侧的所述填料之间设置有金属。 制造布线板或电子部件嵌入式基板的方法包括制备包括含有多种填料的树脂的基板; 在所述基板中形成通孔形成孔; 在通孔形成孔的至少内壁上进行灰化处理; 并且在通孔形成孔的内壁上进行无电镀。

公开(公告)号：US11961652B2

公开(公告)日：2024-04-16

申请号：US16662220

申请日：2019-10-24

Applicant: TDK CORPORATION

Inventor： Hitoshi Ohkubo ,  Masazumi Arata ,  Kenichi Kawabata ,  Atsushi Sato

IPC: H01F27/36 ,  H01F1/20 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2885 ,  H01F1/20 ,  H01F27/29 ,  H01F27/32 ,  H01F27/361

Abstract: In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.

公开(公告)号：US10448546B1

公开(公告)日：2019-10-15

申请号：US16143881

申请日：2018-09-27

Applicant: TDK CORPORATION

Inventor： Takashi Yamada ,  Miyuki Yanagida ,  Atsushi Sato ,  Kenichi Kawabata

IPC: H05K9/00 ,  H01F1/147

Abstract: Disclosed is a noise suppression sheet 1 including a resin layer 2, a non-magnetic metal layer 3, and a metal magnetic layer 4 in this order.

公开(公告)号：US10170431B2

公开(公告)日：2019-01-01

申请号：US15381379

申请日：2016-12-16

Applicant: TDK Corporation

Inventor： Kenichi Kawabata ,  Toshio Hayakawa ,  Toshiro Okubo

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/29 ,  H01L23/00

Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.

公开(公告)号：US09966343B2

公开(公告)日：2018-05-08

申请号：US15464775

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi Kawabata ,  Toshio Hayakawa ,  Toshiro Okubo

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/3205

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2224/81

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to a side surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.

公开(公告)号：US09953932B2

公开(公告)日：2018-04-24

申请号：US15465177

申请日：2017-03-21

Applicant: TDK Corporation

Inventor： Kenichi Kawabata ,  Toshio Hayakawa ,  Toshiro Okubo

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/78 ,  H01L21/3205

CPC classification number: H01L23/552 ,  H01L21/32051 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05442 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014

Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106Ω.

公开(公告)号：US09881877B2

公开(公告)日：2018-01-30

申请号：US15352872

申请日：2016-11-16

Applicant: TDK Corporation

Inventor： Kenichi Kawabata

IPC: H01L23/34 ,  H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  B29C33/00 ,  B29L31/00

CPC classification number: H01L23/552 ,  B29C45/14336 ,  B29C45/14655 ,  B29K2995/0008 ,  B29L2031/712 ,  H01L21/561 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.