Invention Grant
- Patent Title: Sonos device and method for fabricating the same
- Patent Title (中): Sonos装置及其制造方法
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Application No.: US14334158Application Date: 2014-07-17
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Publication No.: US09384989B2Publication Date: 2016-07-05
- Inventor: Ching-Chang Lin , Kai-Hsiang Chang , Chih-Yuan Wu , Kuang-Wen Liu
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Alston & Bird LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/792 ; H01L27/115 ; H01L29/66

Abstract:
An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer layer of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.
Public/Granted literature
- US20140329387A1 Sonos Device and Method for Fabricating the Same Public/Granted day:2014-11-06
Information query
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